Opportunity Information: Apply for DE FOA 0003426
DE-FOA-0003426 is not a traditional grant solicitation. It is a Request for Information (RFI) issued by the U.S. Department of Energy (DOE), on behalf of the Advanced Materials and Manufacturing Technologies Office (AMMTO), to collect public and stakeholder feedback on DOE's Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) Initiative and, more specifically, on a draft EES2 Research, Development, and Demonstration (RDandD) Roadmap that accompanies the RFI. In plain terms, DOE is asking the community to review the draft roadmap and provide input that can shape how the federal government thinks about priorities, gaps, and opportunities for improving the energy efficiency of computing over the next roughly 20 years.
The core focus of the draft EES2 roadmap is the energy efficiency of computing across the full "computing stack." That means DOE is looking beyond just chips in isolation and is considering how gains can come from coordinated advances spanning materials, devices, circuits, architectures, packaging, software, power delivery, manufacturing, measurement, and workforce. The RFI is meant to capture feedback from affected stakeholders broadly, with eligible respondents described as unrestricted. This typically implies DOE wants to hear from industry, academia, national laboratories, consortia, utilities, investors, standards bodies, and other organizations or individuals who have relevant technical or market perspective.
To organize the roadmap, DOE divided the effort into eight specialized working groups, each covering a layer of the computing stack or an enabling area. These working groups informed version 1.0 of the roadmap by identifying emerging energy-efficient technologies, key technical barriers, and potential solution pathways. The eight groups are: Materials and Devices (MnD), Circuits and Architectures (CnA), Advanced Packaging and Heterogenous Integration (APHI), Algorithms and Software (AnS), Power and Control Electronics (PaCE), Manufacturing Energy Efficiency and Sustainability (MEES), Metrology and Benchmarking (MnB), and Education and Workforce Development (EWD). Collectively, these categories signal that DOE is considering energy use end-to-end: from fundamental hardware innovations and integration approaches, to system-level design, to software efficiency, to the energy costs and sustainability of manufacturing, to the measurement and benchmarking needed to prove real-world gains, and finally to the people and training pipelines required to execute at scale.
The practical mechanics are straightforward: responses must be submitted by email to micro.electronics@ee.doe.gov no later than 5:00 pm EDT on September 30, 2024. DOE requires the response to be attached as a Microsoft Word (.docx) document. If the attachment is larger than 25 MB, DOE recommends compressing it (for example, by zipping) to avoid delivery issues. The issuing agency is DOE's Golden Field Office, and the opportunity is categorized as discretionary with an "Other" instrument type, reflecting that it is an information-gathering step rather than a funding action.
A key point is that this RFI is not accepting applications and does not provide financial assistance or incentives. There is no award ceiling and no expected awards because DOE is not making selections or issuing grants through this notice. Instead, DOE is using the input to refine its roadmap and inform future decisions, and it explicitly notes that EERE may or may not issue a future Funding Opportunity Announcement (FOA) based on what it learns. In other words, participating in this RFI is about influencing the direction of potential future DOE programs and investments related to energy-efficient microelectronics and computing, rather than competing for immediate funding.Apply for DE FOA 0003426
- The Golden Field Office in the energy sector is offering a public funding opportunity titled "DE-FOA-0003426: RFI Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) R&D Roadmap — Public Feedback" and is now available to receive applicants.
- Interested and eligible applicants and submit their applications by referencing the CFDA number(s): 81.086.
- This funding opportunity was created on 2024-08-14.
- Applicants must submit their applications by 2024-09-30. (Agency may still review applications by suitable applicants for the remaining/unused allocated funding in 2026.)
- Each selected applicant is eligible to receive up to $2.00 in funding.
- Eligible applicants include: Unrestricted.
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FAQs: DOE RFI DE-FOA-0003426 (EES2 Initiative Draft RD&D Roadmap)
1) What is DE-FOA-0003426?
DE-FOA-0003426 is a Request for Information (RFI) issued by the U.S. Department of Energy (DOE), on behalf of the Advanced Materials and Manufacturing Technologies Office (AMMTO), to collect public and stakeholder feedback on DOE's Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) Initiative and a draft EES2 Research, Development, and Demonstration (RD&D) Roadmap.
2) Is this a grant or funding opportunity?
No. This notice is not a traditional grant solicitation and is not accepting applications. It does not provide financial assistance or incentives, and DOE is not making awards through this RFI.
3) What is DOE asking respondents to do?
DOE is asking the community to review the draft EES2 RD&D Roadmap and submit input that can help shape priorities, identify gaps, and surface opportunities for improving the energy efficiency of computing over the next roughly 20 years.
4) What is the EES2 Initiative focused on?
The EES2 Initiative, as reflected in the draft roadmap, focuses on improving the energy efficiency of computing across the full "computing stack." DOE is looking for coordinated advances that span multiple technical layers rather than improvements in chips alone.
5) What does DOE mean by the "full computing stack" in this RFI?
In this context, the "computing stack" includes areas such as materials, devices, circuits, architectures, packaging, software, power delivery, manufacturing, measurement/benchmarking, and workforce. The roadmap is organized to reflect end-to-end energy use from technology foundations through deployment and validation.
6) Who can respond to this RFI?
Eligible respondents are described as unrestricted. That typically means DOE is seeking input from a broad set of stakeholders, including (but not limited to) industry, academia, national laboratories, consortia, utilities, investors, standards bodies, and other organizations or individuals with relevant technical or market perspective.
7) How is the draft roadmap organized?
DOE divided the roadmap effort into eight specialized working groups. Each group covers a layer of the computing stack or an enabling area, and together they informed version 1.0 of the roadmap by identifying emerging energy-efficient technologies, technical barriers, and potential solution pathways.
8) What are the eight working groups referenced in the RFI?
The eight working groups are:
- Materials and Devices (MnD)
- Circuits and Architectures (CnA)
- Advanced Packaging and Heterogenous Integration (APHI)
- Algorithms and Software (AnS)
- Power and Control Electronics (PaCE)
- Manufacturing Energy Efficiency and Sustainability (MEES)
- Metrology and Benchmarking (MnB)
- Education and Workforce Development (EWD)
9) What types of topics does DOE want feedback on?
Based on the description of the draft roadmap and working groups, DOE is seeking feedback related to improving computing energy efficiency through advances in hardware and software, integration and packaging, power and control, manufacturing sustainability and energy use, measurement and benchmarking approaches, and workforce needs to execute at scale.
10) How do I submit a response?
Responses must be submitted by email to micro.electronics@ee.doe.gov.
11) What is the submission deadline?
The deadline is 5:00 pm EDT on September 30, 2024.
12) What file format is required for the response?
DOE requires the response to be attached as a Microsoft Word (.docx) document.
13) What if my email attachment is too large?
If the attachment is larger than 25 MB, DOE recommends compressing it (for example, by zipping) to avoid delivery issues.
14) Which DOE office is issuing this RFI?
The issuing agency is DOE's Golden Field Office.
15) What is the instrument type and why does it matter?
The opportunity is categorized as discretionary with an "Other" instrument type. This reflects that the notice is an information-gathering step (an RFI) rather than a funding action.
16) Are there award amounts, an award ceiling, or expected awards?
No. There is no award ceiling and no expected awards because DOE is not making selections or issuing grants through this notice.
17) Will DOE issue a future funding opportunity based on this RFI?
DOE notes that EERE may or may not issue a future Funding Opportunity Announcement (FOA) based on what it learns from the RFI responses. Submitting feedback is intended to inform and refine the roadmap and future decisions, not to compete for immediate funding.
18) What is the main benefit of responding if there is no immediate funding?
Responding gives stakeholders a chance to influence how DOE thinks about priorities, gaps, and opportunities related to energy-efficient microelectronics and computing for the next roughly 20 years, and to help shape the draft RD&D roadmap that may inform future program directions.
19) Is this notice limited to microelectronics hardware topics only?
No. The draft roadmap explicitly spans the full computing stack and includes software, power delivery and control, manufacturing energy efficiency and sustainability, measurement and benchmarking, and education/workforce development alongside hardware-focused areas.
20) What should I keep in mind about this RFI compared to a typical FOA?
This RFI is for feedback and information gathering. It is not an application process, does not result in selections, and does not provide financial assistance. Its purpose is to refine DOE's roadmap and inform possible future actions.
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